OJ-IES Editorial Board
FOUNDER EDITOR-IN-CHIEF
Leopoldo G. Franquelo
Professor, Electronics Engineering
Dpto de Ingeniería Electrónica
Universidad de Sevilla
Spain
lgfranquelo@ieee.org
CO-EDITOR-IN-CHIEF
Armando W. Colombo
Professor, Institute for Industrial Informatics
Automation and Robotics (I2AR)
University of Applied Sciences Emden/Leer
Germany
ASSOCIATE EDITORS
Haitham Abu-Rub
Texas A&M University at Qatar, Qatar
Ebrahim Babaei
University of Tabriz, Iran
Federico Baronti
University of Pisa, Italy
Ali Kashif Bashir
Manchester Metropolitan University, UK
Thiago Batista Soeiro
Delft University of Technology, Netherlands
Sertac Bayhan
Hamad Bin Khalifa University, Qatar
Danilo I. Brandao
Universidade Federal de Minas Gerais, Brazil
Giampaolo Buticchi
University of Nottingham, China
Maria-Laura Caliusco
UTN - Facultad Regional Santa Fe, Argentina
Xi Chen
GEIRI North America, USA
Claudia-Melania Chituc
DIPF Leibniz-Institut für Bildungsforschung, Germany
Doriana Marilena D'Addona
University of Naples Federico II, Italy
Daswin De Silva
La Trobe University, Australia
Anton Dianov
Samsung Electronics, Republic of Korea
Yuemin Ding
University of Navarra, Spain
Hairong Dong
Beijing Jiaotong University, China
Huazhen Fang
University of Kansas School of Engineering, USA
Francisco Freijedo
Huawei Technologies, Germany
Lefei Ge
Northwestern Polytechnical University, China
Saeed Golestan
Aalborg Universitet, Denmark
Luis Gomes
University NOVA of Lisbon, Portugal
Gerhard Petrus Hancke
City University of Hong Kong, Hong Kong, China
Juergen Jasperneite
Fraunhofer Society (Fraunhofer IOSB-INA), Germany
Stamatis Karnouskos
SAP, Germany
Ritesh Kumar Keshri
Visvesvaraya National Institute of Technology, India
Chandan Kumar
Indian Institute of Technology Guwahati, India
Jin-Gang Lai
RWTH Aachen University, Germany
Chi-Seng Lam
University of Macau, Macau, China
Paulo Leitao
Instituto Politecnico de Braganca, Portugal
Binbin Li
Harbin Institute of Technology, China
Hong Li
Beijing Jiaotong University, China
Chunhua Liu
City University of Hong Kong, Hong Kong, China
Yushan Liu
Beihang University, China
Andrei Lobov
Norwegian University of Science and Technology, Norway
Oscar Lucia
Universidad de Zaragoza, Spain
Aleksander Malinowski
Bradley University, USA
Milos Manic
Virginia Commonwealth University, USA
Antonio J. Marques Cardoso
CISE | University of Beira Interior (UBI), Portugal
Saad Mekhilef
University of Malaya, Malaysia
Eric Monmasson
University of Cergy-Pontoise, France
Peter Palensky
TU Delft, Netherlands
Edris Pouresmaeil
Aalto University, Finland
Lin Qiu
University of Illinois Urbana-Champaign, United States
Luis Ribeiro
Linköpings universitet, Sweden
Marco Rivera
Universidad de Talca, Chile
Juan Jose Rodriguez-Andina
Universidad de Vigo, Spain
Xinbo Ruan
Nanjing University of Aeronautics and Astronautics, China
Yang Shi
University of Victoria, Canada
Lei Shu
Nanjing Agricultural University, China
Pierluigi Siano
University of Salerno, Italy
Jorge Solsona
UNS-CONICET, Argentina
Giovanni Spagnuolo
University of Salerno, Italy
Thomas I. Strasser
AIT Austrian Inst. of Technology, Austria
Xiaodong Sun
Jiangsu University, China
Hiralal Suryawanshi
Visvesvaraya National Insitute of Technology, India
Hani Vahedi
TU Delft, Netherlands
María Dolores Valdés Peña
Universidad de Vigo, Spain
Dmitri Vinnikov
Tallinn University of Technology, Estonia
Valeriy Vyatkin
Aalto University, Finland and Luleå University of Technology, Sweden
Shuihua Wang
University of Leicester, UK
Guanghui Wen
RMIT University, Australia
Sheldon Williamson
Ontario Tech University, Canada
Weiliang Xu
The University of Auckland, New Zealand
Jun Yang
Loughborough University, UK
Xinghu Yu
Ningbo Institute of Intelligent Equipment Technology Company Ltd., China
Hui Zhang
Beihang University, China
Jingbing Zhang
Advanced Remanufacturing and Technology Centre, Singapore
Zhen Zhang
Tianjin University, China
Xing Zhao
University of York, UK