TIE - Associate Editors


A. ABDELHAKIM
ABB Corp. Research, Sweden

A. ABDEL-KHALIK
Alexandria University, Egypt

L. AFONSO
University of Minho, Portugal

E. BABAEI
Univ. of Tabriz, Iran

S. BAYHAN
Hamad Bin Khalifa University, Qatar

D. BRUCKNER
B&R, Austria

G. BUTICCHI
Univ. of Nottingham, China

W. CHEN
Southeast University, China

X. CHEN
Shibaura Inst. of Tech., Japan

E. CHENG
Hong Kong Polytech. U., Hong Kong

L. DALESSANDRO
Schaffner Group, Switzerland

M. DALLA COSTA
Federal Univ. of Santa Maria, Brazil

P. DAS
State University of New York, USA

T. DRAGICEVIC
Aalborg University, Denmark

H. DU
University of Wollongong, Australia

D. DUJIC
Ecole P.F. Lausanne, Switzerland

S. DWIVEDI
Danfoss Power Electronics A/S, Denmark

O. ELLABBAN
Iberdrola, Qatar

H. FANG
University of Kansas, USA

F. FREIJEDO
Huawei Technologies Duesseldorf GmbH, Germany

Y. FUJIMOTO
Yokohama Nat. Univ., Japan

M. GALEA
University of Nottingham Ningbo, China

F. GAO
UT of Belfort-Montbéliard, France

Z. GAO
Northumbria Univ., U.K.

A. GARCES
Universidad Tecnologica de Pereira, Colombia

B. GEORGE
IIT Madras, India

A. GHAZANFARI
Polytechnique Montréal, Canada

P. GIANGRANDE
University of Nottingham, UK

K. GOPAKUMAR
Indian Inst. of Sci. Bangalore, India

G. GRANDI
Univ. of Bologna, Italy

A. GRIFFO
The University of Sheffield, UK

F. GUO
Zhejiang Univ. of Technology, China

R. GUZMAN
Univesitat Politècnica de Catalunya, Spain

Y. HE
China University of Geosciences, China

M. HILAIRET
University of Franche-Comté, France

Y. HU
University of Liverpool, U.K.

A. IQBAL
Qatar University, Qatar

A. IOINOVICI
Nanjing Univ. of Aeronautics, China

M. R. ISLAM
Univ. of Wollongong, Australia

X. JING
City University of Hong Kong, Hong Kong, China

M. KARIMI
Mississippi State University, USA

S. KEERTHIPATI
IIT, Hyderabad, India

V. KHADKIKAR
Masdar Inst. of Sci. & Tech., UAE

H. KOMURCUGIL
Eastern Mediterranean Univ., Turkey

G. KONSTANTINOU
UNSW Sydney, Australia

A. KRINGS
FEV GmbH, Germany

A. KUPERMAN
Ben-Gurion Univ. of the Negev, Israel

C. S. LAM
University of Macau, China

C. H. T. LEE
Nanyang Technological Univ., Singapore

K. B. LEE
Ajou Univ., Korea

S. S. LEE
Newcastle Univ. in Singapore, Singapore

G. LEI
University of Technology Sydney, Australia

Y. LEI
Xi'an Jiaotong University, China

P. LEZANA
Universidad Técnica Federico Santa María, Chile

H. LI
Beijing Jiaotong Univ., China

H. LI
Northwestern Polytechnical Univ., China

Z. LI
Northeastern University, China

C. LIU
City Univ. of Hong Kong, Hong Kong

Y. LIU
Beihang University, China

Y. LIU
Harbin Institute of Technology, China

O. LOPEZ
University of Vigo, Spain

D. LU
Univ. of Technology Sydney, Australia

Q. LU
Zhejiang University, China

X. LU
Temple University, USA

O. LUCIA
Univ. of Zaragoza, Spain

R. MASTROMAURO
Unive. of Florence, Italy

S. K. MAZUMDER
NextWatt LLC, USA

M. MENGONI
University of Bologna, Italy

M. MOLINAS
Norwegian University of S&T, Norway

M. MONFARED
Ferdowsi Univ. of Mashhad, Iran

J. NA
Kunming University of Science and Technology, China

S. NATEGH
Volvo Cars, Sweden

J. K. NØLAND
Norwegian Univ. of Sci. and Tech., Norway

R. OBOE
Univ. of Padova, Italy

R. M. PALHARES
Federal Univ. of Minas Gerais, Brazil

K. B. PARK
ABB Corp. Research Center, Switzerland

M. PEREZ
U. T. Federico Santa Maria, Chile

J. QIN
Univ. of Sci. and Tech. of China, China

Z. QIN
Delft University of Technology, Netherlands

S. RAHARDJA
Northwestern Polytechnical Univ., China

M. RAKOTONDRABE
Univ. Bourgogne Franche-Comté, France

C. RECH
Federal Univ. of Santa Maria, Brazil

B. REN
Texas Tech Univ., USA

M. SAEEDIFARD
Georgia Inst. of Tech., Atlanta, USA

A. SERPI
NEPSY srl, Italy

M. SHADMAND
University of Illinois, USA

J. SHAN
York University, Canada

J. SHE
Tokyo University of Technology, Japan

X. SHE
GE Global Research, USA

D. SHI
Beijing Institute of Technology, China

P. SIANO
Univ. of Salerno, Italy

Y. P. SIWAKOTI
Univ. of Tech. Sydney, Australia

S. SONG
Northwestern Polytechnical University, China

T. I. STRASSER
AIT Austrian Inst. of Technology, Austria

X. SUN
Jiangsu Univ., China

H. SURYAWANSHI
Visvesvaraya Nat. I. of Tech., India

K. F. TSANG
City Univ. of Hong Kong, Hong Kong

T. TSUJI
Saitama University, Japan

H. VAHEDI
Ossiaco Inc., Canada

S. VAZQUEZ
Univ. of Seville, Spain

D. VINNIKOV
Tallinn University of Technology, Estonia

F. WANG
Chinese Academy of Sciences, China

H. WANG
ShanghaiTech University, China

W. WANG
Beihang University, China

Y. WANG
Harbin Inst. of Tech., China

Z. WANG
Southeast University, China

Z. WEI
Beijing Institute of Technology, China

L. WU
Harbin Institute of Technology, China

L. WU
Shanghai Electric Wind Power Group Co., Ltd, China

W. WU
Shanghai Maritime Univ., China

D. XU
Harbin Inst. of Tech., China

W. XU
Huazhong Univ. of Sci. & Tech., China

T. YAMAGUCHI
Ricoh Company Ltd., Japan

C. YANG
Central South University, China

C. YANG
Univ. of the West of England, U.K.

H. YANG
Southeast University, China

Y. YANG
Aalborg University, Denmark

A. G. YEPES
University of Vigo, Spain

S. YIN
Harbin Inst. of Tech., China

Y. YUAN
Chinese Academy of Sciences, China

L. ZHANG
Nanyang Technological University, Singapore

P. ZHANG
Tsinghua University, China

X. ZHANG
Nanyang Technological University

Z. ZHANG
Technical Univ. of Denmark, Denmark

Z. ZHANG
Tianjin Univ., China