IEEE Transactions on Industrial Cyber-Physical Systems
Announcements
For a limited time, the IES is subsidizing the APC for Associate Editors and reviewers of TICPS by offering a special rate of 100% off, as they collaborate with the journal. This offer cannot be combined with any discounts.
Scope
Cyber-Physical Systems are the engineered systems that are built from, and depend upon, the seamless integration of computation and physical components. The IEEE Transactions on Industrial Cyber-Physical Systems publishes original papers related to a broad scope associated with the industrial cyber-physical systems (ICPS) knowledge domain.
Technical areas:
- Example areas of interest include but are not limited to:
- Engineering and Management of Systems of ICPS,
- Architectures, Technologies, and Tools for ICPS,
- Artificial Intelligence Empowered ICPS,
- Trustworthy and Reliable ICPS,
- Applications of ICPS,
- Education and Training for ICPS.
Editorial Board
Founding Editor-in-Chief
Okyay Kaynak
- Bogazici University, Bebek, Istanbul
- Turkey
-
okyay.kaynak@boun.edu.tr
Associate Editors
Journal Administrators
Information for Authors
Submit your Paper View on IEEE Xplore
- Peer review:
The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual. Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before the review process. Those with a similarity index > 40% will be rejected. - ORCID is required for all authors
All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. ORCID is a persistent unique identifier for researchers and functions similarly to an article’s Digital Object Identifier (DOI). You will need a registered ORCID to submit an article or review a proof in this journal. Learn more about ORCID and sign up for an ORCID today. - IEEE Manuscript Templates for Transactions/Journals can be found here.
TICPS checklist for manuscript submissions
- New manuscripts should not exceed 8 (letters 4) pages including references, authors’ bios and photos. A mandatory page charge is applicable beyond 8 pages if the paper is accepted after the review process.
- In order to follow the single-blind review process, we ask that all the authors be identifiable within the manuscript (DO include authors’ names, their biographies, affiliation, etc.).
- If a significant portion of your manuscript was already published at a conference, the manuscript must include the previous work in the references section.
- TICPS policy does not consider surveys, state of the art review papers or project reports. Only Guest Editors of a Special Section (or submissions allowed by the Editor-in-Chief) are invited to submit such a kind of manuscript.
- Multiple-part papers are subject to an 'Immediate reject' decision unless the authors ask for a consent from the EiC prior to the submission.
- The only file which has to be submitted (uploaded) is the manuscript in PDF format (WORD files are also possible but please be sure that the file was properly converted by the submission system). In order to make it portable you must embed the not standard fonts or avoid them in the PDF file. This is not an easy process, but often all problems are solved when you are printing PDF file from WORD and you will select in printer properties "Press Quality" instead of "Standard".
- Manuscripts must be in IEEE double column format using the templates mentioned above, so that the length of the paper and readability of figures can be evaluated.
- It is a mandatory requirement that the primary e-mail address of all authors is an institutional e-mail. This applies to all authors of each new and revised paper. Papers where this is not satisfied will not enter the review process.
- Your manuscript must be within the scope of IEEE Trans. on Industrial Cyber- Physical Systems. If not, we will not be able to provide adequate review. The cover letter should include a statement on how the submission fits the domain of ICPS.
- All cited papers must be referenced and discussed within the text of the manuscript. Be sure that the manuscript is up to date. It is expected that a significant portion of references are to recently published papers.
Policies and guidelines
- IES Periodicals Editorial Policy and Guidelines
- Excerpt from IEEE publication policy (All IEEE IPR guidelines)
- Multiple Submission Guidelines (Excerpt from IEEE PSPB Operations Manual)
- IEEE Author Center: IEEE author platform with tools and information.
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TII - Special Sections
2022
2021
2020
2019
2018
2017
2016
2015
2014
2013
2012
TII - Associate Editors
Adnan Abu-Mahfouz
Council for Scientific and Industrial Research-Meraka Inst., South Africa
Jose Alfonso Antonino-Daviu
Universidad Politécnica de Valencia, Spain
Reza Arghandeh
StormGeo, StormGeo Inc, Norway
Federico Baronti
University of Pisa, Italy
Pavol Bauer
Delft University of technology, Netherland
Dietmar Bruckner
B&R Corporate, Austria
Md Zakirul Alam Bhuiyan
Fordham University, United States
Francesco Buccafurri
University of Reggio Calabria, Italy
João Catalão
University of Porto, Portugal
Carlo Cecati
University of L’Aquila, Portugal
Gianluca Cena
IEIIT-CNR, Italy
Victor Chang
Aston University, UK
Chinmay Chakraborty
Birla Institute of Technology, India
Paul C.-P. Chao
National Yang Ming Chiao Tung University, Taiwan
Jiming Chen
Zhejiang University, China
Zhenghua Chen
Institute for Infocomm Research, Singapore
Hao Ran Chi
Instituto de Telecomunicacoes Campus Universitario de Santiago, Portugal
Tommy Chow
City University of Hong Kong, China
Marcian Cirstea
Anglia Ruskin, United Kingdom
WenBin Dai
Shanghai Jiao Tong University, China
Hong-Ning Dai
Hong Kong Baptist University, Hong Kong
Daswin De Silva
La Trobe University, Australia
Derui Ding
University of Shanghai for Science and Technology, China
Lei Ding
Nanjing University of Posts and Telecommunications, China
Dragan Djurdjanovic
University of Texas-Austin, USA
Luca Durante
IEIIT, Italy
Mehmet Efe
Hacettepe University, Turkey
Jose Espinoza
Concepcion University, Chile
Jun Fu
Northeastern University, United States
Piotr Gaj
Silesian University of Technology, Poland
Huijun Gao
Harbin Institute of Technology, China
Zhiwei Gao
Northumbria University, United Kingdom
Xiaohua Ge
Swinburne University of Technology, Australia
Mikael Gidlund
Mid Sweden University, Sweden
Luis Gomes
Universidade Nova de Lisboa, Portugal
Giorgio Graditi
National Agency for New Technologies Energy and Economic Sustainable Development, Italy
Antoni Grau
Technical University of Catalonia, Spain
Lech Grzesiak
Warsaw University of Technology, Poland
Jan Haase
University of Luebeck, Germany
Guangjie Han
Hohai University, China
QingLong Han
Swinburne University of Technology, Australia
Gerhard Hancke (Jr)
City University of Hong Kong, Hong Kong, China
Wangli He
East China University of Science and Technology, China
Weng Khuen Ho
National University of Singapore, Singapore
David A. Howey
University of Oxford, UK
Chuxiong Hu
Tsinghua University, China
Shiyan Hu
University of Southampton, UK
Xiaosong Hu
Chongqing University, China
Marina Indri
Politecnico di Torino, Italy
Rutvij Jhaveri
Pandit Deendayal Energy University, India
Bin Jiang
Nanjing University of Aeronautics and Astronautics, China
Jiong Jin
Swinburne University of Technology, Australia
Tamas Kerekes
Aalborg University, Denmark
Il Han Kim
Texas Instruments Inc., USA
Hasan Kömürcügil
Eastern Mediterranean University, Turkey
Charalambos Konstantinou
KAUST, Saudi Arabia
Chung-Hsien Kuo
National Taiwan University, Taiwan
Sam Tak Wu Kwong
City University of Hong Kong, Hong Kong, China
Huiping Li
Northwestern Polytechnical University, China
Kenli Li
Hunan University, China
Chun-Liang Lin
National Chung Hsing University, Taiwan
Honghai Liu
University of Portsmouth, United Kingdom
Wenxin Liu
Lehigh University, USA
Lucia Lo Bello
University of Catania, Italy
Ren Luo
Fair Friend Group (FFG) Company, Global
Ayan Mallik
Arizona State Unicersity, USA
Milos Manic
Virginia Commonwealth University, USA
Suruz Miah
Bradley University, USA
Eric Monmasson
University of Cergy-Pontoise, France
Marcin Morawiec
Gdansk University of Technology, Poland
Toshiyuki Murakami
Keio University, Japan
Zongyu Zuo
Beihang University, China
Edith Ngai
The University of Hong Kong, Hong Kong
Mihoko Niitsuma
Chuo University, Japan
Peter Palensky
Delft University of Technology, Netherlands
Yongping Pan
Sun Yat-sen University, China
Zhibo Pang
ABB, Corporate Research, Sweden
Chen Peng
Shanghai University, China
Francesco Piccialli
University of Naples FEDERICO II, Italy
Jiahu Qin
University of Science and Technology of China, China
Robin G. Qiu
Pennsylvania State University, USA
Thilo Sauter
AIT Austrian Inst. of Technology, Austria
Lei Shu
Nanjing Agricultural University, China
Pierluigi Siano
University of Salerno, Italy
Amit Singh
National Institute of Technology Patna, India
Adam Slowik
Koszalin University of Technology, Poland
Thomas I. Strasser
AIT Austrian Inst. of Technology, Austria
Yang Tang
East China University of Science and Technology, China
Federico Tramarin
University of Modena and Reggio Emilia, Italy
Ching-Chih Tsai
National Ching Hsing University, Taiwan
Kim Fung Tsang
City University of Hong Kong, China
Abhisek Ukil
University of Auckland, New Zealand
Adriano Valenzano
Institute of Electronics, Computer and Telecommunications Engineering (IEIIT), Italy
Francisco Vasques
University of Porto, Portugal
Stefano Vitturi
National Research Council of Italy, Italy
Jiafu Wan
South China University of Technology, China
Guanghui Wen
Southeast University, China
Remigiusz Wisniewski
University of Zielona Gora, Poland
Hongyu Wu
Kansas State University, USA
Sheng-Dong Xu
Taiwan University of Science and Technology, Taiwan
Fuwen Yang
Zhejiang University, China
Zaiyue Yang
Griffith University, Australia
Shen Yin
Norwegian University of Science and Technology (NTNU), Norway
Wenwu Yu
Southeast University, China
Yan Zhang
University of Oslo, Norway
Zhen Zhang
Tianjin University, China
Ahmed Faheem Zobaa
Brunel University, United Kingdom
Gerhard Zucker
AIT Austrian Inst. of Technology, Austria
Zongyu Zuo
Beihang University, China
TII - News
All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. ORCIDs enable accurate attribution and improved discoverability of an author's published work. The author will need a registered ORCID in order to submit a manuscript or review a proof in this journal.
Follow these steps to link a ScholarOne account to a registered ORCID:
- Login to ScholarOne and click on your name in the top right corner of the screen.
- Click E-mail / Name in the dropdown menu.
- In the ORCID section at the top of the page, click the appropriate link to either register for a new ORCID or associate the account with an existing ORCID.
- A new page will open to create and/or validate your ORCID. Once the validation is complete, the new page will close and you will return to ScholarOne.
- Save the changes to your ScholarOne user account.
Authors who do not have an ORCID in their ScholarOne user account will be prompted to provide one during submission.