IEEE Industrial Electronics Society IEEE Industrial Electronics Society IEEE Industrial Electronics Society

IEEE Transactions on Industrial Cyber-Physical Systems

TICPSEditorial BoardInformation for AuthorsPolicies and guidelines
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Announcements


SEP
2023
TICPS is soliciting contributions for the special collection on "System and Embedded Device Security for Openly Deployed Industrial Cyber-Physical Systems." The related Call for Paper is available here.
AUG
2023
TICPS is soliciting contributions for the special collection on "The emergence of the industrial metaverse." The related Call for Paper is available here.
MAY
2023
TICPS is soliciting proposals for Special Collections. The related document is available here.
DEC
2022
TIPCS is a hybrid journal, i.e. it will publish both open-access and regular papers. The authors will have the choice. However, in compliance with Plan S, TIPCS is committed to eventually transitioning to a fully OA journal over time. Authors receiving research grants from Coalition S funders are therefore compliant with Plan S requirements when publishing their research articles in TIPCS. Please see https://open.ieee.org/transformative-journals-plans/ for more details.
DEC
2022

For a limited time, the IES is subsidizing the APC for Associate Editors and reviewers of TICPS by offering a special rate of 100% off, as they collaborate with the journal. This offer cannot be combined with any discounts.


Scope

Cyber-Physical Systems are the engineered systems that are built from, and depend upon, the seamless integration of computation and physical components. The IEEE Transactions on Industrial Cyber-Physical Systems publishes original papers related to a broad scope associated with the industrial cyber-physical systems (ICPS) knowledge domain.

Technical areas:

  • Example areas of interest include but are not limited to:
  • Engineering and Management of Systems of ICPS,
  • Architectures, Technologies, and Tools for ICPS,
  • Artificial Intelligence Empowered ICPS,
  • Trustworthy and Reliable ICPS,
  • Applications of ICPS,
  • Education and Training for ICPS.

 

Editorial Board

Founding Editor-in-Chief

Okyay Kaynak

Okyay Kaynak

Associate Editors

Complete list of Associate Editors is listed here. Sep. 2023 updated

 

Journal Administrators

Yogendra Tripathy
y.tripathy@ieee.org

 

Information for Authors


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  • Peer review:
    The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual. Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before the review process. Those with a similarity index > 40% will be rejected.
  • ORCID is required for all authors
    All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. ORCID is a persistent unique identifier for researchers and functions similarly to an article’s Digital Object Identifier (DOI). You will need a registered ORCID to submit an article or review a proof in this journal. Learn more about ORCID and sign up for an ORCID today.
  • IEEE Manuscript Templates for Transactions/Journals can be found here.

TICPS checklist for manuscript submissions

  1. New manuscripts should not exceed 8 (letters 4) pages including references, authors’ bios and photos. A mandatory page charge is applicable beyond 8 pages if the paper is accepted after the review process.
  2. In order to follow the single-blind review process, we ask that all the authors be identifiable within the manuscript (DO include authors’ names, their biographies, affiliation, etc.).
  3. If a significant portion of your manuscript was already published at a conference, the manuscript must include the previous work in the references section.
  4. TICPS policy does not consider surveys, state of the art review papers or project reports. Only Guest Editors of a Special Section (or submissions allowed by the Editor-in-Chief) are invited to submit such a kind of manuscript.
  5. Multiple-part papers are subject to an 'Immediate reject' decision unless the authors ask for a consent from the EiC prior to the submission.
  6. The only file which has to be submitted (uploaded) is the manuscript in PDF format (WORD files are also possible but please be sure that the file was properly converted by the submission system). In order to make it portable you must embed the not standard fonts or avoid them in the PDF file. This is not an easy process, but often all problems are solved when you are printing PDF file from WORD and you will select in printer properties "Press Quality" instead of "Standard".
  7. Manuscripts must be in IEEE double column format using the templates mentioned above, so that the length of the paper and readability of figures can be evaluated.
  8. It is a mandatory requirement that the primary e-mail address of all authors is an institutional e-mail. This applies to all authors of each new and revised paper. Papers where this is not satisfied will not enter the review process.
  9. Your manuscript must be within the scope of IEEE Trans. on Industrial Cyber- Physical Systems. If not, we will not be able to provide an adequate review. The cover letter to be submitted should include a statement on how the submission fits the domain of ICPS. Otherwise, your submission will be unsubmitted.
  10. All cited papers must be referenced and discussed within the text of the manuscript. Be sure that the manuscript is up to date. It is expected that a significant portion of references are to recently published papers.

 

Final Files:

Please submit all final files through the Awaiting Final Files queue in your Author Center in ScholarOne Manuscripts. Make sure your final package is correct and complete upon submission. Once you have completed the submission of your final files you will receive updates from the IEEE production team on the publication progress of your manuscript.

The following are the final files required to start the production of your manuscript for publication:

  1. A source file of your manuscript in either Microsoft Word or LaTex
  2. A publication-ready PDF of the manuscript which will appear as Early Access article on IEEE Xplore. The publication-ready PDF must match the source file.
  3. If applicable, all supplemental material such as multimedia or graphical abstract
  4. All figures, if not already embedded into the source files

Please visit the IEEE Author Center: (https://journals.ieeeauthorcenter.ieee.org/create-your-ieee-article/) for additional tools, instructions and manuscript templates.

You may not make any unauthorized changes to your manuscript at this time. ONLY CORRECTIONS OF TYPOS AND DELETION OF DUPLICATED REFERENCES ARE ALLOWED - IF SUCH CHANGES ARE DONE A SEPARATE .TXT FILE, EXPLAINING THEM, MUST BE INCLUDED IN THE FINAL FILE SUBMISSION PACKAGE. IEEE will perform a comparison of your accepted paper to your final submission, and any changes outside of what the Editor has requested will need to be justified and approved before publication, causing delays. This includes content and references.

*Note, no changes in the author list, regarding either the order of the authors or the names, are allowed post-acceptance.

Upon submitting your final files the process in ScholarOne is complete. You will be redirected to the IEEE Author Gateway (AG), which is your portal to track the progress of your paper through the production process. From here you can:

  1. Sign your Electronic Copyright Form (eCF) and select the appropriate publication agreement
  2. Obtain information regarding color fees
  3. Make payments for any additional overlength fees
  4. Contact the Open Access Department (oaprocessing@ieee.org) for any questions regarding open access
  5. Contact the Reprints Department (reprints@ieee.org) for all other billing questions

 

Policies and guidelines


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