IEEE Transactions on Industrial Cyber-Physical Systems
Announcements
For a limited time, the IES is subsidizing the APC for Associate Editors and reviewers of TICPS by offering a special rate of 100% off, as they collaborate with the journal. This offer cannot be combined with any discounts.
Scope
Cyber-Physical Systems are the engineered systems that are built from, and depend upon, the seamless integration of computation and physical components. The IEEE Transactions on Industrial Cyber-Physical Systems publishes original papers related to a broad scope associated with the industrial cyber-physical systems (ICPS) knowledge domain.
Technical areas:
- Example areas of interest include but are not limited to:
- Engineering and Management of Systems of ICPS,
- Architectures, Technologies, and Tools for ICPS,
- Artificial Intelligence Empowered ICPS,
- Trustworthy and Reliable ICPS,
- Applications of ICPS,
- Education and Training for ICPS.
Editorial Board
Founding Editor-in-Chief
Okyay Kaynak
- Bogazici University, Bebek, Istanbul
- Turkey
-
okyay.kaynak@boun.edu.tr
Journal Administrators
y.tripathy@ieee.org
Associate Editors
Dietmar Bruckner
B&R Corporate, Austria
Armando Colombo
University of Applied Sciences, Germany
Tingwen Huang
Texas A&M University, Qatar
Stamatis Karnouskos
SAP, Germany
Yang Shi
University of Victoria, Canada
Thomas Strasser
AIT Austrian Inst. of Technology, Austria
Ching-Chih Tsai
National Ching Hsing University, Taiwan
Valeriy Vyatkin
Luleå Tekniska University, Sweden
Shen Yin
Harbin Institute of Technology, China
Xinghuo Yu
RMIT University STEM College, Australia
Information for Authors
Submit your Paper View on IEEE Xplore
- IEEE Manuscript Templates for Transactions/Journals can be found here.
- TICPS follows Single-blind review process. Therefore author details need to be added in the manuscript
Policies and guidelines
- IES Periodicals Editorial Policy and Guidelines
- Excerpt from IEEE publication policy (All IEEE IPR guidelines)
- Multiple Submission Guidelines (Excerpt from IEEE PSPB Operations Manual)
- IEEE Author Center: IEEE author platform with tools and information.
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TII - Special Sections
2022
2021
2020
2019
2018
2017
2016
2015
2014
2013
2012
TII - Associate Editors
Adnan Abu-Mahfouz
Council for Scientific and Industrial Research-Meraka Inst., South Africa
Kamal Al-Haddad
Ecole de Technologie Superieure, Canada
Jose Alfonso Antonino-Daviu
Universidad Politécnica de Valencia, Spain
Reza Arghandeh
StormGeo, StormGeo Inc, Norway
Federico Baronti
University of Pisa, Italy
Pavol Bauer
Delft University of technology, Netherland
Dietmar Bruckner
B&R Corporate, Austria
Francesco Buccafurri
University of Reggio Calabria, Italy
João Catalão
University of Porto, Portugal
Carlo Cecati
University of L’Aquila, Portugal
Gianluca Cena
IEIIT-CNR, Italy
Elizabeth Chang
UNSW Canberra, Australia
Victor Chang
Aston University, UK
Jiming Chen
Zhejiang University, China
Tommy Chow
City University of Hong Kong, China
Marcian Cirstea
Anglia Ruskin, United Kingdom
WenBin Dai
Shanghai Jiao Tong University, China
Hong-Ning Dai
Macau University of Science and Technology, China
Marco Di Natale
Scuola Superiore Sant'Anna, Italy
Dragan Djurdjanovic
University of Texas-Austin, USA
Mehmet Efe
Hacettepe University, Turkey
Jose Espinoza
Concepcion University, Chile
Jun Fu
Northeastern University, United States
Piotr Gaj
Silesian University of Technology, Poland
Huijun Gao
Harbin Institute of Technology, China
Zhiwei Gao
Northumbria University, United Kingdom
Mikael Gidlund
Mid Sweden University, Sweden
Luis Gomes
Universidade Nova de Lisboa, Portugal
Giorgio Graditi
National Agency for New Technologies Energy and Economic Sustainable Development, Italy
Antoni Grau
Technical University of Catalonia, Spain
Lech Grzesiak
Warsaw University of Technology, Poland
Jan Haase
University of Luebeck, Germany
QingLong Han
Swinburne University of Technology, Australia
Gerhard Hancke (Jr)
City University of Hong Kong, Hong Kong, China
Weng Khuen Ho
National University of Singapore, Singapore
David A. Howey
University of Oxford, UK
Shiyan Hu
University of Southampton, UK
Marina Indri
Politecnico di Torino, Italy
Stamatis Karnouskos
SAP, Germany
Marian Kazmierkowski
Warsaw University of Technology, Poland
Tamas Kerekes
Aalborg University, Denmark
Il Han Kim
Texas Instruments Inc., USA
Hasan Kömürcügil
Eastern Mediterranean University, Turkey
Péter Korondi
Hungarian Academy of Sciences, Hungary
Chung-Hsien Kuo
National Taiwan University, Taiwan
Sam Tak Wu Kwong
City University of Hong Kong, Hong Kong, China
Huiping Li
Northwestern Polytechnical University, China
Kenli Li
Hunan University, China
Chun-Liang Lin
National Chung Hsing University, Taiwan
Honghai Liu
University of Portsmouth, United Kingdom
Wenxin Liu
Lehigh University, USA
Lucia Lo Bello
University of Catania, Italy
Ren Luo
Fair Friend Group (FFG) Company, Global
Chengbin Ma
Shanghai Jiao Tong University, China
Aleksander Malinowski
Bradley University, Illinois, USA
Ayan Mallik
Arizona State Unicersity, USA
Milos Manic
Virginia Commonwealth University, USA
Suruz Miah
Bradley University, USA
Eric Monmasson
University of Cergy-Pontoise, France
Toshiyuki Murakami
Keio University, Japan
Edith Ngai
The University of Hong Kong, Hong Kong
Mihoko Niitsuma
Chuo University, Japan
Peter Palensky
Delft University of Technology, Netherlands
Chen Peng
Shanghai University, China
Zhibo Pang
ABB, Corporate Research, Sweden
Francesco Piccialli
University of Naples FEDERICO II, Italy
Daswin De Silva
La Trobe University, Australia
Jiahu Qin
University of Science and Technology of China, China
Robin G. Qiu
Pennsylvania State University, USA
Joze Rodriguez
Universidad Tecnica Federico Santa Maria, Chile
Juan Jose Rodriguez-Andina
University of Vigo, Spain
Thilo Sauter
AIT Austrian Inst. of Technology, Austria
Dimitrios Serpanos
University of Patras, Greece
Lei Shu
Guangdong University of Petrochemical Technology, China
Pierluigi Siano
University of Salerno, Italy
Amit Singh
National Institute of Technology Patna, India
Adam Slowik
Koszalin University of Technology, Poland
Thomas I. Strasser
AIT Austrian Inst. of Technology, Austria
Federico Tramarin
University of Modena and Reggio Emilia, Italy
Ching-Chih Tsai
National Ching Hsing University, Taiwan
Kim Fung Tsang
City University of Hong Kong, China
Abhisek Ukil
University of Auckland, New Zealand
Adriano Valenzano
Institute of Electronics, Computer and Telecommunications Engineering (IEIIT), Italy
Francisco Vasques
University of Porto, Portugal
Stefano Vitturi
National Research Council of Italy, Italy
Birgit Vogel-Heuser
Technical University Munich, Germany
Valeriy Vyatkin
Lulea Tekniska Universitet, Sweden
Bogdan Wilamowski
Auburn University, Alabama, USA
Remigiusz Wisniewski
University of Zielona Gora, Poland
Hongyu Wu
Kansas State University, USA
Sheng-Dong Xu
Taiwan University of Science and Technology, Taiwan
Zaiyue Yang
Zhejiang University, China
Shen Yin
Norwegian University of Science and Technology (NTNU), Norway
Wenwu Yu
Southeast University, China
Dong Yue
Nanjing University of Posts and Telecommunication, China
Yan Zhang
University of Oslo, Norway
Zhen Zhang
Tianjin University, China
Ahmed Faheem Zobaa
Brunel University, United Kingdom
Gerhard Zucker
AIT Austrian Inst. of Technology, Austria
TII - News
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Follow these steps to link a ScholarOne account to a registered ORCID:
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- In the ORCID section at the top of the page, click the appropriate link to either register for a new ORCID or associate the account with an existing ORCID.
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Authors who do not have an ORCID in their ScholarOne user account will be prompted to provide one during submission.