TICPS - Associate Editors
Dietmar Bruckner
B&R Corporate, Austria
Armando Colombo
University of Applied Sciences, Germany
Tingwen Huang
Texas A&M University, Qatar
Stamatis Karnouskos
SAP, Germany
Yang Shi
University of Victoria, Canada
Thomas Strasser
AIT Austrian Inst. of Technology, Austria
Ching-Chih Tsai
National Ching Hsing University, Taiwan
Valeriy Vyatkin
Luleå Tekniska University, Sweden
Shen Yin
Harbin Institute of Technology, China
Xinghuo Yu
RMIT University STEM College, Australia
TICPS - Associate Editors
Dietmar Bruckner
B&R Corporate, Austria
Armando Colombo
University of Applied Sciences, Germany
Tingwen Huang
Texas A&M University, Qatar
Stamatis Karnouskos
SAP, Germany
Yang Shi
University of Victoria, Canada
Thomas Strasser
AIT Austrian Inst. of Technology, Austria
Ching-Chih Tsai
National Ching Hsing University, Taiwan
Valeriy Vyatkin
Luleå Tekniska University, Sweden
Shen Yin
Harbin Institute of Technology, China
Xinghuo Yu
RMIT University STEM College, Australia